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march 2008 rev 3 1/22 AN533 application note scrs, triacs, and ac switches, thermal management precautions for handling and mounting introduction the behavior of a semiconductor device depends on the temperature of its silicon chip. this is why electrical parameters are given at a specified temperature. to sustain the performance of a component and to avoid failure, the temperature has to be limited by managing the heat transfer between the chip and the ambient atmosphere. the aim of this note is to show how to calculate a suitable heatsink for a semiconductor device and the precautions needed for handling, mounting and soldering techniques. www.st.com
contents AN533 2/22 contents 1 through-hole packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 thermal resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 thermal impedance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 1.3 insulating materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 1.4 insulated components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 1.5 handling and mounting techniques . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 1.6 through-hole package wave soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 2 surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 2.1 thermal resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 2.2 thermal impedance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 2.3 mounting techniques and r th(j-a) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 2.4 reflow soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 3 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
AN533 through-hole packages 3/22 1 through-hole packages 1.1 thermal resistance 1.1.1 review the thermal resistance of semiconductor assembly is the parameter which characterizes its resistance to the heatflow generated by the junction during operation. a temperature exceeding the maximum junction temperature curtails the electrical performance and may damage the device. the maximum dissipated power capability is: where: t j max is the maximum junction temperature of the semiconductor in degrees ( c) t a is the ambient air temperature in degrees ( c) r th (j-a) is the thermal resistance between junction and ambient air in c/w the r th(j-a) takes into account all materials between the junction and ambient air. an analogy between ohm?s law and the thermal equivalent circuit can be made: electrical resistance corresponds to thermal resistance current corresponds to dissipated power voltage corresponds to temperature thus: v = r . i corresponds to t = r th . p 1.1.2 dissipated power for a thyristor or a triac the maximum power dissipation versus average on-state current (for scrs) or rms on- state current (for triacs) is given in the datasheet for each product. however, a more accurate result is obtained by using the v to and r d values with the following calculation: p = v to . i t(av) + r d . i 2 t(rms) where: v to is the threshold voltage specified in the datasheet r d is the dynamic on-state resistance specified as r d in the datasheet i t(av) is the average on-state current i t(rms) is the rms on-state current figure 1 shows the rms and average values for different waveforms of current. p max = t jmax -t a r th(j-a)
through-hole packages AN533 4/22 figure 1. rms and average currents 1.1.3 dissipated power in a triac a triac is made up of two thyristors connected back to back. this means we consider the sum of the dissipated power of both thyristors. the following formula gives the total dissipated power versus i t(rms) current through the triac (see figure 1 c with t 0 = 0): for a phase angle conduction the rms current is given in figure 1 c. 1.1.4 triac without external heatsink figure 2 shows the thermal equivalent diagram for a triac without external heatsink. in practice the imposed parameters are: t a : ambient air temperature where the triac is located r th(j-a) : thermal resistance between junction and ambient air given in the datasheet p: dissipated power in the triac depending on the used triac and on the load current the following equation defines the junction temperature depending on these parameters: t j = p . r th(j-a) + t a i p a b c i p i p t 0 t/2 t/2 t t t t 0 t t t i t(av) = 2 . i p .t 0 .t i t(av) = i t(av) = 1 - + . sin 2 . i p 2 . i p . i t(rms) = 2 i p 2 2 t 0 i t(av) = i(t)dt 1 t i t(rms) = 2 i 2 (t)dt t 0 1 t i t(rms) = 2 i p 2 .t 0 2 . t i t(rms) = 2 i p 2 2 1 2 . 2 . t 0 t 4 . . t 0 t ( ( ( ( ( ( cos t 0 . 2 t p = 2 . 2 .i t(rms) .v t0 + r d .i t(rms) 2
AN533 through-hole packages 5/22 figure 2. thermal equivalent diagram 1.1.5 triac with external heatsink if the estimated junction temperature is higher than the maximum junction temperature specified in the datasheet, a heatsink has to be used. recommendation: this calculation has to be made in the worst case scenario i.e with the maximum dissipated power, load and line voltage dispersions. we have to consider the maximum ambient temperature around the component i.e. inside the box where the triac is located. the same approach as presented in the previous section allows a suitable heatsink to be defined. figure 3 shows the thermal equivalent diagram. figure 3. thermal equivalent diagram with external heatsink junction ambient air t j r th(j-a) t a junction heatsink ambient air t j r th(j-c) t c rth(c-h) th rth(h-a) t a case
through-hole packages AN533 6/22 the formula to calculate the thermal resistance between heatsink and ambient air is the following: where: t j is the junction temperature in c p is the maximum dissipated power in w r th(j-c) is the thermal resistance between junction and case in c/w r th(c-h ) is the thermal resistance between case and heatsink in c/w, depending on the contact case/heatsink. since the current alternates in a triac, we have to consider the r th(j-c) in alternating current which is different to the r th(j-c) in direct current. this difference is due to the die of the triac. the first half of the silicon die works when the current is positive, the second when the current is negative. because of the thermal coupling between these two parts, this gives the following equation. r th(j-c)ac = 0.75 . r th(j-c)dc 1.1.6 choice of heatsink choosing a heatsink depends on several parameters; the thermal characteristic, the shape and the cost. however, in some applications a flat heatsink can be sufficient. figure 4 shows the curve rth(h-a) versus the length of a flat square heatsink for different materials and thickness. some applications need heatsinks with an optimized shape where the thermal resistances are not known. for this, the best solution involves measuring the case temperature of the component in the worst case scenario and keeping to the following formula: t c < t jmax - p . r th(j-c) where: t c is the case temperature t jmax is the maximum junction temperature p is the dissipated power in the component r th(j-c) is the thermal resistance between junction and case. r th(h-a) = t j -ta p - r th(j-c) - r th(c-h)
AN533 through-hole packages 7/22 figure 4. r th(h-a) versus the length of a flat square heatsink 1.1.7 forced cooling for high power or very high power applications, a forced-air or liquid cooling heatsink may be required. heatsink manufacturers give a coefficient depending on the air or liquid flow. however, in some applications like vacuum cleaners, dissipated power is only a few watts and air flow cooling is available. this allows a very small heatsink to be used, very often a flat aluminium heatsink. in this case it is necessary to measure the case temperature in the worst case scenario and to check the following formula: t c < t jmax - p . r th(j-c) 1.2 thermal impedance in steady state, a thermal equivalent circuit can be made only with thermal resistances. however, for pulse operation it can be useful to consider the thermal impedance, especially when the component is on during a time lower than the time to reach the thermal resistance. the thermal impedance value versus pulse duration is given in the datasheets (see an example in figure 5 ), in the form of the relationship z th /r th plotted against pulse duration. for example, bta08-600sw is able to dissipate 27 w without heatsink during 1 s: z th(j-a) can be obtained from the datasheet by reading the value of the ratio z th /r th from the curve (in the case of this product the ratio is 0.06 as seen in figure 5 ) and multiplying the ratio by the value of r th(j-a) from the datasheet. for this example r th(j-a) is 60 c/w r th(h-a) 100 50 30 20 10 1 2 3 5 steel thickness of the plate in mm 0 2 8 14 4 10 16 6 12 18 20 0.5 1 2 5 r th(h-a) 100 50 30 20 10 1 2 3 5 (c/w) copper thickness of the plate in mm (cm) 0 2 8 14 4 10 16 6 12 18 20 length 0.5 1 2 5 r th(h-a) 100 50 30 20 10 1 2 3 5 (c/w) aluminium thickness of the plate in mm (cm) 0 2 8 14 4 10 16 6 12 18 20 length 0.5 1 2 5 length (c/w) (cm) - semiconductor device in the center - bare convector (no ventilation) - vertical position thermal model for calculation based on square heatsink l e p = t jmax -t amax z th(j-a) (1 s) p = 125 - 25 60 x 0.06 = 27.5 w
through-hole packages AN533 8/22 in steady state, with the same ambient temperature, the same triac is able to dissipate: figure 5. thermal transient impedance of a bta08-600sw. 1.3 insulating materials we can classify them in 3 types as following: mica insulators this has been the most commonly used insulator for many years. its insulating quality is good, but due to its rigidity the thermal interface is not very good, and needs contact grease on both sides. because of its rigidity it can be easily broken. ceramic insulators more expensive than mica, their thermal resistances are lower. due to their rigidity, they also need contact grease. however, they can be easily broken, as they are less fragile than mica. silicone insulators these materials are not rigid and therefore do not need contact grease. they assume the shape of the component and of the heatsink if sufficient pressure is applied. the problems previously explained disappear. according to manufacturers, the stability in time is much better than with contact grease. however the thermal resistance is higher than the combination of the mica + grease. p = 125 - 25 60 = 1.7 w 1e-3 1e-2 1e-1 1 s 1e+1 1e+2 5e+2 1e-3 1e-2 1e-1 1e+0 t p (s) k=[z th /r th ] z th(j-c) to-220ab z th(j-a) 0.06
AN533 through-hole packages 9/22 ta b l e 1 shows the thermal resistance for different to-220ab insulators and for a given pressure (f = 30 n). 1.4 insulated components most of the thyristors and triacs manufactured by stmicroelectronics are available in insulated and non-insulated packages. for insulated packages, insulation can be achieved in two different ways: ceramic between the die pad and the heatsink of the component (to-220ab / top3 / rd91 packages) resin used for encapsulation (isowatt220ab / to-220fpab packages) all insulated packages delivered by stmicroelectronics are in accordance with ul1557 recognition applicable for "electrically isolated semiconductors". the added material increases the thermal resistance between the junction and the case, but the total thermal resistance (r th(j-a) ) is lower than the one when using a non insulated component with an external insulating material. in addition, it simplifies assembly and reduces the cost. for two 16 a triacs in to-220ab package, r th(j-c)ac values ( c/w) are shown in ta b l e 2 : 1.5 handling and mounting techniques the use of inappropriate techniques or unsuitable tools during handling and mounting can affect the long term reliability of the device, or even damage it. 1.5.1 bending and cutting leads lead bending must be done carefully. the lead must be firmly held between the plastic package and the bending point during lead operation. if the package / lead interface is strained, the resistance to humidity is impaired and in addition mechanical stress is inflicted on the die. this damage can affect the long term reliability of the devices. table 1. r th(c-h) for different materials for to-220ab package contact grease mica + grease thickness = 80 m mica dry thickness = 80 m silicone insulator r th(c-h) c 0.5 1.7 4 2.6 table 2. comparison of r th(j-c) for sample insulated and non-insulated products bta16-600c (insulated version) btb16-600c (non-insulated version) 2.1 device 1.2 device + 0.5 grease + 1.7 mica + grease = 2.6 total = 2.9 total
through-hole packages AN533 10/22 there are six basic rules to bear in mind: 1. never clamp the plastic package ( figure 6 ). figure 6. clamping the lead not the package 2. clamp the leads firmly between the plastic package and the bend / cut point ( figure 7 ). figure 7. clamping the lead between the package and the bend / cut point 3. bend the leads at least 3 mm from the plastic package ( figure 8 ). figure 8. bending the lead at least 3 mm from the plastic package plastic package spaced clamp mechanism clamp mechanism lead forming or cutting mechanism ? ? ? ? incorrect correct 3 mm correct incorrect
AN533 through-hole packages 11/22 4. never bend the leads laterally ( figure 9 ). figure 9. bending the leads laterally (not allowed) 5. never bend the leads more than 90 and never bend more than once. 6. make sure that the bending / cutting tool does not damage the leads. 1.5.2 using a heatsink mounting surface preparation the mounting surface should be flat, clean and free of burrs and scratches. the use of a thin layer of thermal silicone grease ensures a very low contact thermal resistance between the component and the heatsink. an excessively thick layer or a excessively viscous silicone grease may have the opposite effect and cause the deformation of the tab. the planarity of the contact surface between device and heatsink must be very low (less than 50 m for to-220ab). insertion if the heatsink is mounted on the pc board, it should be attached to the component before the soldering process of the leads. mounting techniques mounting must be done carefully. excessive stress may induce distortion of the tab and as a consequence mechanical damage on the die. soldering: it is not recommended for through-hole packages. incorrect
through-hole packages AN533 12/22 with rivets: pop rivets should never be used for the following reasons: a too rigorous expansion of the metal can lead to a distortion of the heatsink hole and induce mechanical stresses on the die. high crimping shock can damage the die. press rivets can be used with caution provided they are of a soft metal like aluminium. the crimping force must be applied slowly and carefully in order to avoid shock and deformation of the heatsink. figure 10. assembly with rivet with clips: care should be taken with the contact area between the plastic case and the clip: the maximum pressure allowed on plastic is 150 n/mm2. over this value, cracks may be induced in the package. therefore, the clips have to be round or smooth in the contact area to avoid concentrated loads on the plastic body. the force applied on the component depends on the heatsink and the component thickness, so they must be specially designed to take this value into account. screw assembly is preferred to clip assembly for insulated packages. figure 11. clip assembly rivet contact grease component heatsink contact grease d component clip heatsink
AN533 through-hole packages 13/22 with screws: the following precautionary measures should be taken: to avoid tab distortion, a rectangular washer must be put between the screw head and the tab, and a compression washer must be put between the tab and the nut. figure 12. correct assembly take care to avoid mechanical shock during screwing. keep the screw straight. appropriate screwing torque should be used, excessive screwing torque may cause the distortion of the tab and induce bad thermal contact. in addition it can generate cracks in the die. figure 13. incorrect assembly the thermal contact resistance depends on the force generated by the applied torque on the screw: where: t is applied torque on the screw in n.m p is pitch in m d is screw diameter in m r is rubbing factor: # 0.12 for steel-steel with grease and # 0.2 for steel-aluminium the relative variation of the r th(c-h) , compared with the value of r th(c-h) at 0.6 nm versus the torque for an m3 screw used for the to220ab is given in figure 14 . washer m3 screw washer lock washer nut contact grease heatsink component washer m3 screw washer lock washer nut bad thermal contact heatsink component f = 2 . t . p + r . d .
through-hole packages AN533 14/22 figure 14. relative variation of r th(c-h) compared with r th(c-h) at 0.6 nm versus torque for to-220ab table 3. recommended torque and thermal contact resistance package torque (nm) thermal contact resistance (c/w) to-220ab / pentawatt 0.4 to 0.6 (1) 1. for btb20-xxx, btb24-xxx and tynxx40, the maximum torque is 0.5 nm. 0.5 isowatt220 / to-220fpab 0.4 to 0.6 0.5 top3 / top3i 0.9 to 1.2 0.1 rd91 0.9 to 1.2 0.1 2.00 r th(c-h) /r th(c-h) at 0.6 nm 1.50 1.00 1.75 1.25 0.75 0.50 0.1 0.4 0.2 0.6 torque (nm)
AN533 through-hole packages 15/22 1.6 through-hole package wave soldering the lead-free through-hole devices may be soldered with lead-free solder pastes or alloys (sn-ag-cu based alloys). the typical soldering temperature is 260 c. alternatively these devices may be soldered with snpb based solder pastes. the soldering temperature is then typically around 220 c. interface adherences on through-hole package structures are qualified to sustain only 3 consecutive dips of their connections in a solder pot at 260 c (-0 c / +5 c) . immersion duration: 10 seconds each delay between 2 dippings: 5 minutes minimum distance solder to package plastic body: according to packages, by default 1mm lead-free devices are described in an internal specification defining: their characteristics: lead-free connection coating, solderability and identification features their reliability such as soldering resistance, reliability performances, whiskers risk prevention. this specification is available for st customers upon request (title: ecopack ? components definition & characteristics). please consult that document for further information. ecopack is a registered trademark of stmicroelectronics
surface mount packages AN533 16/22 2 surface mount packages 2.1 thermal resistance the thermal resistance of a semiconductor device characterizes the device?s capability to dissipate the heat generated by the chip during operation. this parameter allows us to calculate the junction temperature, taking into account the device environment (load current, ambient temperature, mounting conditions etc...). for surface mounted devices (smds), the thermal resistance between junction and ambient, called r th(j-a) , depends on the copper surface used under the tab. figure 15 shows curves giving the relation between r th(j-a) and the copper surface under the tab for an fr4 board - 35 m copper thickness. figure 15. rth(j-a) versus copper surface under tabs (fr4 board - copper thickness = 35 m) for several typical packages 2.2 thermal impedance when dealing with short duration pulses, the thermal impedance must be considered to calculate the junction temperature. depending on the time scale, the following elements are thermally prevalent: t p < 10 ms: die influence t p < 0.1 s: package influence t p < 10 s: pcb influence above 10 s: thermal exchange board-air (example: with / without forced cooling) figure 16 shows the z th / r th ratio for smd packages and figure 17 shows z th(j-a) for dpak and d 2 pa k . 012345 0 10 20 30 40 50 60 70 80 90 100 110 120 130 s(cu) (cm2) rth(j-a) (c/w) sot-223 dpak d 2 pa k 02468101214161820 0 20 40 60 80 100 s(cu) (cm2) rth(j-a) (c/w) 0 4 8 1216202428323640 0 10 20 30 40 50 60 70 80 s(cu) (cm2) rth(j-a) (c/w)
AN533 surface mount packages 17/22 figure 16. relative variation of thermal impedance junction to ambient versus pulse duration figure 17. typical z th(j-a) for dpak and d 2 pak 2.3 mounting techniques and r th(j-a) r th(j-a) varies with the printed circuit board technology. different technologies can be used depending on the performance required in the design. four techniques are commonly used: fr4 - copper ims (insulated metal substrate) fr4 board with copper filled through holes + heatsink ims + heatsink. 1e-3 1e-2 1e-1 1e+0 1e+1 1e+2 0.01 0.10 1.00 tp(s) zth(j-a)/ rth(j-a) 1e-3 1e-2 1e-1 1e+0 1e+1 1e+2 5e+2 0.01 0.10 1.00 tp(s) zth(j-a) / rth(j-a) sot-23 sot-223 0.001 0.01 0.1 1 10 100 1,000 0.1 0.2 0.5 1 2 5 10 20 50 z th(j-a) infinite heatsink ims floating in air fr4 die package board board/air influence of the various mounting elements
surface mount packages AN533 18/22 figure 18. mounting techniques for power smds as the fr4 board is commonly used in surface mounting techniques, there are several ways of overcoming its low thermal performance: use of large heat spreader areas (heat sink) at the copper layer of the pcb use of copper-filled through holes in addition to an external heatsink for an even better thermal management however, due to its power dissipation limitation, using the fr4 board with these techniques is advisable only for currents up to 8 a max. a technology available today is insulated metallic substrate (ims). this offers greatly enhanced thermal characteristics for surface mount components. ims is a substrate consisting of three different layers: base material which is available as an aluminum or a copper plate thermal conductive dielectric layer copper foil, which can be etched as a circuit layer. even if a higher power is to be dissipated, an external heatsink can be applied leading to an r th(j-a) of 4.5 c/w (see ta bl e 4 ). this is commonly applied in practice, leading to reasonable heatsink dimensions. often, power devices are defined by considering the maximum junction temperature of the device. in practice, however, this is far from being fully exploited. the designer should carefully consider which is appropriate mounting method (see ta b l e 4 ) to be used according to the dissipated power. the type of board will influence the thermal performance of the system. ta b l e 4 shows the r th(j-a) depending on the mounting techniques for dpak and d2pak. copper foil insulation aluminium / copper fr4 board copper foil footprints copper foil fr4 board heatsink copper-filled through-holes copper foil insulation aluminium / copper heatsink 1 3 2 4
AN533 surface mount packages 19/22 2.4 reflow soldering information the surface mount assembly is a 4-step process. 1. solder paste printing 2. component placement on the board 3. reflow soldering 4. cleaning (optional) the soldering process causes considerable thermal stress to a semiconductor component. this has to be minimized to assure a reliable and extended lifetime of the device. sot-23, sot-223, so-8 and dpak packages can be exposed to a maximum temperature of 260 c for 10 to 30 seconds. for the d 2 pak package the maximum temperature is 245 c. overheating during the reflow soldering process may damage the device, therefore any solder temperature profile should be within these limits. reflow techniques are most common in surface mounting. typical heating profiles for leadfree solder (st ecopack) are given in figure 19 for small packages (sot-23, sot-223, dpak), either for mounting on a fr4 or on metal-backed boards (ims). please refer to the ipc/jedec j-std-020c standard for further information about ?small? and ?large? component definitions. note: soldering profile defined in ipc/jedec j-std-020c standard is used for reliability assessment and typically describes warmest profiles used for component mounting, not the necessary temperatures to achieve good soldering. wave soldering is not advisable for dpak and d2pak because it is almost impossible to contact the whole package slug during the process. table 4. r th(j-a) for dpak and d 2 pak according to mounting method mounting method rth (j-a) dpak d 2 pa k fr4 70 c/w 50 c/w fr4 with 10 cm2 heatsink on board 40 c/w 35 c/w fr4 with copper filled holes and external heatsink 13 c/w 12 c/w ims (40 cm2) in free air 9 c/w 8 c/w ims with external heatsink 4.5 c/w 3.5 c/w
surface mount packages AN533 20/22 figure 19. st ecopack recommended soldering reflow profile for small packages for each individual board, the appropriate heat profile has to be adjusted experimentally. the current proposal is just a starting point. in every case, the following precautions have to be considered: always preheat the device. the purpose of this step is to minimize the rate of temperature rise to less than 3 c per second (recommended 2 c/s) to minimize the thermal shock on the component. dryout section, after preheating, ensures that the solder paste is fully dried before starting reflow step. also, this step allows the temperature gradient on the board to be evened out. peak temperature should be at least 30 c higher than the melting point of the solder alloy chosen to ensure the reflow quality. in any case the peak temperature should not exceed 260 c. lead-free devices are described in an internal specification defining: their characteristics: lead-free connection coating, solderability and identification features their reliability such as soldering resistance, reliability performances, whiskers risk prevention. this specification is available for st customers upon request (title: ecopack components definition & characteristics). please consult that document for further information about reflow and wave soldering. voids pose a difficult reliability problem for large surface mount devices. such voids under the package result in poor thermal contact and the high thermal resistance leads to component failures. coplanarity between the substrate and the package can be easily verified. the quality of the solder joints is very important for two reasons: poor quality solder joints directly result in poor reliability. solder thickness affects the thermal resistance significantly. thus, tight control of this parameter results in thermally efficient and reliable solder joints. 0 01234567 time (min) temperature (c) 2c/s recommended 6c/s max 220c 125 c 260c max 255c 180c 90 sec max 10-30 sec 90 to 150 sec 3c/s max 0 01234567 time (min) temperature (c) 2c/s recommended 6c/s max 220c 125 c 260c max 255c 180c 90 sec max 10-30 sec 90 to 150 sec 3c/s max
AN533 revision history 21/22 3 revision history table 5. revision history date revision changes nov-1997 1 initial release. oct-2000 2 latest update 10-mar-2008 3 reformatted to current standards. general update of all equations, and graphics.
AN533 22/22 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in military, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or register ed trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2008 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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